> ## Documentation Index
> Fetch the complete documentation index at: https://docs.hologram.io/llms.txt
> Use this file to discover all available pages before exploring further.

# Hologram IoT SIM datasheets

> Hologram provides global IoT SIMs for every use case. Hardware and software specifications for Hologram IoT Hyper SIMs along with downloadable PDFs are available in this guide. SIMs are available in triple cut card, embedded MFF2, and eSIM form factors across SGP.02, SGP.22, and SGP.32 specifications.

Hologram Hyper SIMs are industrial-grade eUICC SIMs available in triple cut (2FF/3FF/4FF) and embedded SIM (MFF2 DFN8) form factors. Industrial-grade SIMs support wide operating temperatures and extended lifecycle applications.

## SIM card specifications

### Hyper SIM - SGP.02

<Frame>
  <img src="https://mintcdn.com/hologram-b29df2a6/7ecdk_UVCk1HGOnK/images/sims/sim-cards/sgp02-hyper-sim-mockup.webp?fit=max&auto=format&n=7ecdk_UVCk1HGOnK&q=85&s=d25ff2971f887c2c64cc8bfe5fcfe888" alt="SGP.02 Triple Cut Hyper SIM card example" width="1341" height="408" data-path="images/sims/sim-cards/sgp02-hyper-sim-mockup.webp" />
</Frame>

**Triple cut format**

* Mini (2FF): 25mm × 15mm × 0.71 mm
* Micro (3FF): 15mm × 12mm × 0.71 mm
* Nano (4FF): 12.3mm × 8.8mm × 0.71 mm

**Embedded SIM format**

* MFF2 (DFN8): 6 × 5 × 0.82 mm

**Operating characteristics**

* Electrical: 1.62V to 5V
* Operational temperature: -40°C to +105°C (Industrial grade)
* Available memory: 414,384 bytes
* eUICC: SGP.02 v4.2
* Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M

<Card title="Download SGP.02 Hyper SIM datasheet (Triple cut)" href="https://cdn1.hologram.io/docs/datasheets/2026_SGP.02_Hyper_SIM_Triple_Cut_Format_Datasheet.pdf" horizontal icon="sim-card" />

<Card title="Download SGP.02 Hyper SIM datasheet (Embedded)" href="https://cdn1.hologram.io/docs/datasheets/2026_SGP.02_Hyper_SIM_Embedded_Format_Datasheet.pdf" horizontal icon="microchip" />

### Hyper SIM - SGP.32

<Frame>
  <img src="https://mintcdn.com/hologram-b29df2a6/7ecdk_UVCk1HGOnK/images/sims/sim-cards/sgp32-hyper-sim-mockup.webp?fit=max&auto=format&n=7ecdk_UVCk1HGOnK&q=85&s=05a5a35f2ccc9bc8bef97baa0d8c7c6a" alt="SGP.32 Triple Cut Hyper SIM card example" width="1341" height="408" data-path="images/sims/sim-cards/sgp32-hyper-sim-mockup.webp" />
</Frame>

**Triple cut format**

* Mini (2FF): 25mm × 15mm × 0.71 mm
* Micro (3FF): 15mm × 12mm × 0.71 mm
* Nano (4FF): 12.3mm × 8.8mm × 0.71 mm

**Embedded SIM format**

* MFF2 (DFN8): 6 × 5 × 0.82 mm

**Operating characteristics**

* Electrical: 1.62V to 5V
* Operational temperature: -40°C to +105°C (Industrial grade)
* Available memory: 318,936 bytes
* eUICC: SGP.32 v1.2, SGP.22 v2.5
* Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M

<Card title="Download SGP.32 Hyper SIM datasheet (Triple cut)" href="https://cdn1.hologram.io/docs/datasheets/2026_SGP.32_Hyper_SIM_Triple_Cut_Format_Datasheet.pdf" horizontal icon="sim-card" />

<Card title="Download SGP.32 Hyper SIM datasheet (Embedded)" href="https://cdn1.hologram.io/docs/datasheets/2026_SGP.32_Hyper_SIM_Embedded_Format_Datasheet.pdf" horizontal icon="microchip" />

 

## Previously available Hologram SIMs

Global G1 and Canada G2 eUICC SIMs are no longer manufactured, but details remain for reference.

<AccordionGroup>
  <Accordion title="G1 Global SIM - SGP.02 — Triple Cut">
    **Triple cut format**

    * Mini (2FF): 25mm × 15mm × 0.71 mm
    * Micro (3FF): 15mm × 12mm × 0.71 mm
    * Nano (4FF): 12.3mm × 8.8mm × 0.71 mm

    **Operating characteristics – Standard grade**

    * Electrical: 1.6V, 3V, and 5V
    * Operational temperature: -25°C to +85°C
    * Memory (NVM): 340 KB
    * Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M

    **Operating characteristics – Industrial grade**

    * Electrical: 1.62V to 5.5V
    * Operational temperature: -40°C to +105°C
    * Memory (NVM): 704 KB
    * Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M

    <a href="https://cdn1.hologram.io/docs/datasheets/2024_Global_G1_Triple_Cut_SIM_Datasheet.pdf">Download datasheet (Global G1 Triple Cut)</a>
  </Accordion>

  <Accordion title="G1 Global SIM - SGP.02 — Embedded">
    **Embedded SIM format**

    * MFF2 (DFN8): 6 × 5 × 0.82 mm

    **Operating characteristics**

    * Electrical: 1.6V, 3V, and 5V
    * Operational temperature: -25°C to +85°C
    * Memory (NVM): 340 KB
    * Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M

    <a href="https://cdn1.hologram.io/docs/datasheets/2024_Global_G1_Embedded_SIM_Datasheet.pdf">Download datasheet (Global G1 Embedded)</a>
  </Accordion>

  <Accordion title="G2 Canada SIM - SGP.02 — Triple Cut">
    **Triple cut format**

    * Mini (2FF): 25mm × 15mm × 0.71 mm
    * Micro (3FF): 15mm × 12mm × 0.71 mm
    * Nano (4FF): 12.3mm × 8.8mm × 0.71 mm

    **Operating characteristics**

    * Electrical: 1.62V to 5.5V
    * Operational temperature: -25°C to +85°C
    * Memory (NVM): 704 KB
    * Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M

    <a href="https://cdn1.hologram.io/docs/datasheets/2024_Canada_G2_Triple_Cut_SIM_Datasheet.pdf">Download datasheet (Canada G2 Triple Cut)</a>
  </Accordion>
</AccordionGroup>

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