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Hologram Hyper SIMs are industrial-grade eUICC SIMs available in triple cut (2FF/3FF/4FF) and embedded SIM (MFF2 DFN8) form factors. Industrial-grade SIMs support wide operating temperatures and extended lifecycle applications.

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SIM card specifications

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Hyper SIM - SGP.02

SGP.02 Triple Cut Hyper SIM card example
Triple cut format
  • Mini (2FF): 25mm × 15mm × 0.71 mm
  • Micro (3FF): 15mm × 12mm × 0.71 mm
  • Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Embedded SIM format
  • MFF2 (DFN8): 6 × 5 × 0.82 mm
Operating characteristics
  • Electrical: 1.62V to 5V
  • Operational temperature: -40°C to +105°C (Industrial grade)
  • Available memory: 414,384 bytes
  • eUICC: SGP.02 v4.2
  • Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M

Download SGP.02 Hyper SIM datasheet (Triple cut)

Download SGP.02 Hyper SIM datasheet (Embedded)

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Hyper SIM - SGP.32

SGP.32 Triple Cut Hyper SIM card example
Triple cut format
  • Mini (2FF): 25mm × 15mm × 0.71 mm
  • Micro (3FF): 15mm × 12mm × 0.71 mm
  • Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Embedded SIM format
  • MFF2 (DFN8): 6 × 5 × 0.82 mm
Operating characteristics
  • Electrical: 1.62V to 5V
  • Operational temperature: -40°C to +105°C (Industrial grade)
  • Available memory: 318,936 bytes
  • eUICC: SGP.32 v1.2, SGP.22 v2.5
  • Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M

Download SGP.32 Hyper SIM datasheet (Triple cut)

Download SGP.32 Hyper SIM datasheet (Embedded)

 

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Previously available Hologram SIMs

Global G1 and Canada G2 eUICC SIMs are no longer manufactured, but details remain for reference.
Triple cut format
  • Mini (2FF): 25mm × 15mm × 0.71 mm
  • Micro (3FF): 15mm × 12mm × 0.71 mm
  • Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics – Standard grade
  • Electrical: 1.6V, 3V, and 5V
  • Operational temperature: -25°C to +85°C
  • Memory (NVM): 340 KB
  • Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Operating characteristics – Industrial grade
  • Electrical: 1.62V to 5.5V
  • Operational temperature: -40°C to +105°C
  • Memory (NVM): 704 KB
  • Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Download datasheet (Global G1 Triple Cut)
Embedded SIM format
  • MFF2 (DFN8): 6 × 5 × 0.82 mm
Operating characteristics
  • Electrical: 1.6V, 3V, and 5V
  • Operational temperature: -25°C to +85°C
  • Memory (NVM): 340 KB
  • Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Download datasheet (Global G1 Embedded)
Triple cut format
  • Mini (2FF): 25mm × 15mm × 0.71 mm
  • Micro (3FF): 15mm × 12mm × 0.71 mm
  • Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics
  • Electrical: 1.62V to 5.5V
  • Operational temperature: -25°C to +85°C
  • Memory (NVM): 704 KB
  • Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Download datasheet (Canada G2 Triple Cut)

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